TAS Consulting

PUBLICATIONS — 21 Patents and 8 Papers

Papers

• • IMAPS New England 43nd Sumposium and Expo — May 3, 2016. Session Chair and Speaker for the SMT/Flip Chip Board Level Packaging Group. Presentation and Paper, "Flexible Electronics - Packaging Design."
• • IMAPS New England 42nd Sumposium and Expo — May 5, 2015. Session Chair and Speaker for the SMT/Flip Chip Board Level Packaging Group. Presentation and Paper, "Solder Fatigue for Lead and Lead-Free Solders with Best Practices."
• • IMAPS New England 41st Sumposium and Expo — May 6, 2014. Presentation and Paper, "Defense Electronics Trends Affecting High-end Electronics."
• • IMAPS New England 40th Sumposium and Expo — May 7, 2013. Presentation and Paper, "Design and Design for Manufacture Improvement using CAD & Simulation."
• • IMAPS Automotive Conference — May 22-24, 2012. Presentation and Paper, "Reliability Concerns - Pitfalls and Issues." Download the slide presentation by clicking here.
• • IMAPS New England 39th Symposium and Expo — May 8, 2012. Presentation and Paper, "Improved Reliability with Different Materials." To obtain the slide presentation, click here.
• • Operationally Responsive Space 8 Conference / Space News Article - March 2010. Presentation and Paper, "Nanoeye Program" - Coauthored - highlights the NanoEye program 10-inch satellite payload.
• • "Silicone Gel Potting used for Underhood Engine Controller using Ball Grid Array Components." Paper on the effect of silicone gel potting viscosity on BGA and surface mount solder joints fatigue and the resulting life and reliability - submitted to SAE 9/15/00 - presented at SAE, March 2001.

Patents

• • ITT/Kodak - 2004-2010. Twelve patents submitted for defect reduction in assemblies and thermal management for dense electronics, deformable mirrors, and optics.
• • Chrysler – 1999-2002. Nine patents dealing with RF Grounding (EMI/EMC), Adhesives development, Strain Relief, Thermal Management, and manufacturing producibility.

PATENTS

Patent Granted

1. 7,161,240  "Insitu-cooled electrical assemblage"
2. 6,930,885  "Densely packed electronic assemblage with heat removing element"
3. 6,882,537  "Electrical assemblage and method for removing heat locally generated therefrom"
4. 6,820,328  "Method of removing heat from an electronic assemblage"
5. 6,771,504  "Thermal transport element for use with a heat dissipating electrical assemblage"
6. 6,770,967  "Remote thermal vias for densely packed electrical assemblage"
7. 6,678,159  "Method of transporting heat from a heat dissipating electrical assemblage"
8. 6,671,176  "Method of cooling heat-generating electrical components"
9. 6,477,052  "Multiple layer thin flexible circuit board"
10. 5,981,870  "Flexible circuit board interconnect with strain relief"
11. 5,924,873  "Flexible circuit board interconnect with strain relief"
12. 5,917,149  "Flexible circuit board interconnect with strain relief"

Patent Pending

1. 2005/0284607  "Cooling-assisted, heat-generating electrical component and method of manufacturing same"
2. 2005/0063162  "Electrical Assemblage and Method for Removing Heat Locally Generated Therefrom"
3. 2004/0120121  "Densely packed electronic assemblage with heat removing element"
4. 2004/0120118  "Thermal Transport Element for use with a Heat Dissipating Electrical Assemblage"
5. 2004/0119157  "Remote Thermal Vias for Densely Packed Electrical Assemblage"
6. 2004/0117982  "Method of removing heat from an electronic assemblage"
7. 2004/0000711  "Insitu-cooled electrical assemblage"
8. 2003/0062196  "Anchor point for RF circuit boards and related methods"
9. 2003/0029637  "Circuit board assembly with ceramic capped components and heat transfer vias"
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